Since TFE is by engineers for engineers, there was little publicity, and almost everything was to the point. This is a backhanded way of saying it was a good thing to go to. Initially, the conference centered on future thermal problems facing the chip industry, and has since moved on to other topics like power, EMI and acoustics. It is continually broadening, and is now a good way to kick off discussions on where things are going in PCs. If you look at the agenda, you can see what AMD/ATI is nervous about in the 2-3 years out time frame.