Our other solution was to replace the stock heatsink unit with a radial design that improved airflow around the CPU area to the point where the boards did not experience thermal related shutdowns or catastrophic failure when we played “Pop goes the MOSFET”. We found that increasing our case airflow provided temperature drops in the PWM/MOSFET area about 5~11C better than the radial fan design. However, our processor temperature dropped about 3C at idle and averaged 9C lower at load when compared to the stock heatsink. Additionally, acoustic levels dropped on average about 4dB(A) with the radial fan setup.