Memory
Memory
Breaking: Spansion Files Bankruptcy PDF Print E-mail
Written by Matthew Cameron   
Monday, 02 March 2009 13:18
Spansion, formally of AMD blood (Still has some in its veins), has decided to follow half of the companies in this country into Bankruptcy. Apparently Spansion as a company is in great shape. They just can't pay back all of their debt right now. No problem though as they can expect to get a bailout. The WSJ has more.
Last Updated on Monday, 02 March 2009 16:13
 
Spansion Cuts 3,000 Jobs PDF Print E-mail
Written by Chris Tom   
Tuesday, 24 February 2009 22:33
AMD spinoff Spansion has cut 3,000 jobs according to Digitimes.

"The global recession is forcing us to make this very difficult decision in order to bring our costs in line with the current expectations for significantly reduced revenues," said John Kispert, Spansion president and CEO. "This action was not undertaken lightly given its impact on our employees and their families. However, we have a responsibility to preserve the value of the enterprise as we pursue our goal of positioning Spansion for a recovery through a restructuring and/or sale."

 
DDR2 vs DDR3, Phenom II X3 720 BE Awesome PDF Print E-mail
Written by Jeff_Tom   
Wednesday, 18 February 2009 18:31
AnandTech have an update on DDR2 vs DDR3 memory testing and love the Phenom II X3 720 BE. It is their pick for best current bang for the buck CPU as well as many other sites.

Speaking of the 720BE processor, I have to say this little jewel is currently my favorite bang for the buck processor. I have had an absolute blast testing this processor and when overclocked, it truly takes on a "devil with a blue dress" persona. I highly suggest you take a serious look at this processor if you are in the market for an upgrade right now. Anyway, we will be back shortly with our first results and some additional details about the AM3 platform.

 
AMD Not Concerned About GDDR5 Supply PDF Print E-mail
Written by Chris Tom   
Wednesday, 04 February 2009 14:13
The Inquirer reports that GDDR5 supplies could be constrained thanks to financial difficulties at many of the memory manufacturers. They do however believe that Samsung could probably handle all the GDDR5 production. They asked AMD about the situation, and they seemed to not be concerned.

DAAMIT says it currently feeds from all three GDDR5 suppliers, although we've only seen Qimonda kit soldered to their babies. "We have two other suppliers for GDDR5 memory and they are Hynix and Samsung. Today they do supply us with devices and they are qualified on our SKUs. There is no concern from AMD on supply of GDDR5 going forward and we only expect things to improve as GDDR5 penetrates more markets." Said Cap'n Hook at DAAMIT HQ. No worries there then. Nvidia's spokesbunny was a bit more coy about the technology "Qimonda's announcement has no impact on NVIDIA's business. We work with multiple memory suppliers to ensure that we have sufficient supply for all our GPU needs."

 
Toshiba, IBM, and AMD Develop World’s Smallest FinFET SRAM Cell with PDF Print E-mail
Written by Chris Tom   
Wednesday, 17 December 2008 09:04

-- Area of Nonplanar-FET SRAM Cell Cut by More Than 50%; Establishes Promising Approach for Future Technology Nodes --

2008 International Electron Devices Meeting

TOKYO & NEW YORK & SUNNYVALE, Calif.--Toshiba Corporation (TOKYO:6502), IBM (NYSE:IBM), and AMD (NYSE:AMD) today announced that they have together developed a Static Random Access Memory (SRAM) cell that has an area of only 0.128 square micrometers (, the world’s smallest functional SRAM cell that makes use of fin-shaped Field Effect Transistors (FinFETs).

The cell, developed with a high-k/metal gate (HKMG) material, offers advantages over planar-FET cells for future technology generations. SRAM cells are circuit components in most systems-level, large-scale integrated circuits such as microprocessors, and smaller SRAM cells can help provide smaller, faster processors that consume less power. The technology was announced on December 16 in a technical paper presented at the 2008 International Electron Devices Meeting (http://www.his.com/~iedm/general/) in San Francisco, California.

To reduce the transistor size when SRAM cells are created using conventional planar transistors, IC manufacturers generally adjust properties by doping more impurities into the device area. However, this adjustment creates undesirable variability and deteriorates the SRAM stability. This issue is becoming critical, especially at the 22nm technology node and beyond. The use of FinFETs -- vertical transistors with fin-shaped undoped silicon channels -- is an alternative approach to allow SRAM cell size reduction with less characteristic variation.

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