Athlon II X3 435 & X2 240e
Athlon II X3 435 & X2 240e PDF Print E-mail
Written by Jeff_Tom   
Tuesday, 20 October 2009 09:11
Article Index
Athlon II X3 435 & X2 240e
Test system, Crysis, UT3
Cinebench, Valve benchmarks, POV-Ray
Power Consumption, Overclocking
Conclusion
All Pages

 

 

 


If you thought AMD was done with the Phenom II and Athlon II product line-up you were wrong as they continue to put out new products in this case new Athlon II processors. Today AMD launches triple core Athlon II processors which will start with 4xx in their model number and new lower power processors across the line with "e" at the end of the model number. We'll be looking at specifically the Athlon II X3 435 processor and the Athlon II X2 240e processor.

 

 

The 435 is a triple core Athlon II processor clocked at 2.9GHz. As with all the Athlon II processors there is no L3 cache, it's built using a 45nm process, features 64K of L1 cache per core and 512KB of L2 cache. It's derivative of the Phenom II architecture but isn't built using die harvesting from Phenom II CPUs.

 

 

The 240e is a dual core Athlon II processor clocked at 2.8GHz. As with all the Athlon II processors there is no L3 cache, it's built using a 45nm process, features 64K of L1 cache per core and 1MB of L2 cache per core. AMD rates this and other "e" processors at 45W.

Here's a list of processors launching today and price ranges.


Athlon II X4 605e (2.3GHz) $143 USD
Athlon II X4 600e (2.2GHz) $133 USD
Athlon II X3 435 (2.9GHz) $87 USD
Athlon II X3 425 (2.7GHz) $76 USD
Athlon II X3 405e (2.3GHz) $102 USD
Athlon II X3 400e (2.2GHz) $97 USD
Athlon II X2 240e (2.8GHz) $77 USD
Athlon II X2 235e (2.7GHz) $69 USD
Note: the 435 and 425 are standard processors rated at 95W
Note: “e” indicates a low-power processor with a maximum power rating of just 45W

 

Here are the technical specifications on the Athlon II X3 435 processor.

New Athlon II X3 435 Processor Specifications:
Model Number & Core Frequency: X3 435 / 2.9GHz
OPN: ADX435WFK32GI
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (384KB total L1 per processor)
L2 Cache Sizes: 512KB of L2 data cache per core (1.5MB total L2 per processor)
Memory Controller Type: Integrated 128-bit wide memory controller *
Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported: Unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth: Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
Up to 33.1GB/s total bandwidth [Up to 17.1 GB/s memory bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location: GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany (formerly AMD Fab 36)
Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size: 169mm2 **
Approximate Transistor count: ~300 million **
Max Temp: 73o Celsius
Nominal Voltage: 0.875-1.425V
Max TDP: 95 Watts
*Note: configurable for dual 64-bit channels for simultaneous read/writes
**Note: this specification is for a “Propus” die

 

 

And here are the technical specifications on the Athlon II X2 240e.

New Athlon II X2 240e Processor Specifications:
Model Number & Core Frequency: X2 240e / 2.8GHz
OPN: AD240EHDK23GQ
L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per processor)
L2 Cache Sizes: 1MB of L2 data cache per core (2MB total L2 per processor)
Memory Controller Type: Integrated 128-bit wide memory controller *
Memory Controller Speed: 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported: Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-8500 (DDR3-1066MHz)
HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth: Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2 or DDR3-1066) + 16.0GB/s (HT3)]
Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location: GLOBALFOUNDRIES Fab 1 Module 1
Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size: 117.5 mm2
Approximate Transistor count: ~ 234 million
Max Temp: 72 degrees Celsius
Nominal Voltage: .775 – 1.35V
Max TDP: 45 Watts
*Note: configurable for dual 64-bit channels for simultaneous read/writes